群馬大学 · 理工学部（物質・環境類）

研究キーワードsolder joints・electroplating・resin adhesion・electronic packaging・diffusion bonding・corrosion behavior

ここは公開データのプレビューです。個別の適合理由、連絡角度、保存機能はログイン後に利用できます。

• Assessment of Adhesion Degradation in A1050/Epoxy Resin Interface under High-Humidity and High-Temperature Aging Conditions under High-Humidity and High-Temperature Aging Conditions, Tatsuya Kobayashi, Ryota Nakagawa, Ikuo Shohji, Fumiya Funatomi, Kyohei Ohashi, Ryuki Sakai, 2026年01月16日, Key Engineering Materials, 1039, 53, 592026 · 論文
• Comparison of Pd-42Cu-10Ni and Pd-30Cu-29.5Ag-0.5Zn as Probe Material in Interfacial Reaction with Sn of Pd-42Cu-10Ni and Pd-30Cu-29.5Ag-0.5Zn as Probe Material in Interfacial Reaction with Sn, Rin Hashizume, Tatsuya Kobayashi, Ikuo Shohji, Tomohisa Hoshino, Kenichi Sato, Shunsuke Kobayashi, Naohito Odani, 2026年01月16日, Materials Science Forum, 1175, 117, 1222026 · 論文
• Investigation of Degradation Behavior of Adhesion between Sealing Resin and Copper by Aging Treatment Degradation Behavior of Adhesion between Sealing Resin and Copper by Aging Treatment, Anzu Tozaki, Tatsuya Kobayashi, Ikuo Shohji, Hiroto Takenaka, Hirose Suzuki, Minoru Ueshima, 2026年01月19日, Materials Science Forum, 1176, 59, 642026 · 論文
• Analysis of Generation and Propagation of Fatigue Crack in Oxygen-Free Copper Using Electron Backscattered Diffraction Method, Hiroki Yonekura, Tatsuya Kobayashi, Ikuo Shohji, 2026年01月15日, Solid State Phenomena, 383, 89, 95, 研究論文（学術雑誌）2026 · 論文

• 公式プロフィール