Gunma University · Faculty of Science and Engineering (Materials and Environmental Sciences) · 教授

Research keywordslead-free solder・solder joint reliability・electromigration・thermal fatigue・microjoining・interfacial reactions・electronic packaging・plating films

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• Effect of Thermal Cycle Profile on Thermal Fatigue Life of Sn-3.0Ag-0.5Cu Solder Joints for Wafer-Level Chip Scale Package, Shun Sakagami, Kenta Kawaguchi, Tatsuya Kobayashi, Ikuo Shohji, Fumiya Funatomi, Kyohei Ohashi, Ryuki Sakai, 2026年01月20日, Key Engineering Materials, 1040, 55, 612026 · 論文
• Analysis of Generation and Propagation of Fatigue Crack in Oxygen-Free Copper Using Electron Backscattered Diffraction Method, Hiroki Yonekura, Tatsuya Kobayashi, Ikuo Shohji, 2026年01月15日, Solid State Phenomena, 383, 89, 952026 · 論文
• Assessment of Adhesion Degradation in A1050/Epoxy Resin Interface under High-Humidity and High-Temperature Aging Conditions, Tatsuya Kobayashi, Ryota Nakagawa, Ikuo Shohji, Fumiya Funatomi, Kyohei Ohashi, Ryuki Sakai, 2026年01月16日, Key Engineering Materials, 1039, 53, 592026 · 論文
• Evaluation of Joining Properties Between Potential-Controlled Ni-Cu Alloy Plating Film and Pb-Free Solder, Tatsuya Kobayashi, Sota Mori, Ikuo Shohji, 2026年01月16日, Key Engineering Materials, 1039, 61, 662026 · 論文

• パワー半導体素子用熱交換システムのハイブリッド化に関する研究
• 低温焼結性金属ナノ粒子の創製と精密組立接合への応用
• 第三元素添加によるSn-Bi系低温実装対応鉛フリーはんだの共晶組織微細化効果
• ＳｉＣパワーデバイス用高機能樹脂／金属異相界面の創製

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