Hirosaki University · Graduate School of Science and Engineering

Research keywordselectromigration・flexible interconnects・high-density current・magnetic field effects・metallic thin films・electronic reliability

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• Influence of magnetic field on electromigration behavior in metallic thin interconnects under high-density electric current2026 · THIN SOLID FILMS 837 2026年03月
• Topology Optimization for the Electronic Line Considering Joule Heat2025 · ASME INTERPACK 2025 Proceedings 2025年10月
• Effect of Backflow on Electromigration Damage in Die Attach Structure Using Sintered Ag Joints2025 · ASME INTERPACK 2025 Proceedings 2025年10月
• Semi-analytical solution of axisymmetric indentation of poroelastic multi-layer coating on a substrate2025 · ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik 105 ( 9 ) e70209 2025年09月

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