Hokkaido University · Research Center for Quantum Integrated Electronics

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• Within-Wafer and Within-Die Uniformity of Bond Strength for Hybrid Bonding2025 · 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 287, 288, IEEE, 2025年04月15日
• Factors determining bond wave speed in wafer bonding2025 · JAPANESE JOURNAL OF APPLIED PHYSICS, 64, 3, 2025年03月01日
• Direct Physical Vapor Deposition of Liquid Metal on Treated Metal Surface2025 · ACS APPLIED ELECTRONIC MATERIALS, 7, 9, 3656, 3666, 2025年04月15日
• Assessing Queue Time in D2w Hybrid Bonding Through Precise Bond Strength Measurements2025 · 2025 IEEE 75th Electronic Components and Technology Conference (ECTC), 878, 884, IEEE, 2025年05月27日

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