Osaka University · Institute of Scientific and Industrial Research · 特任准教授

This is a public-data preview. Personalized fit, contact angles, and saved workflows require sign-in.

• Real-time detection of fracture mode at the direct bonded Chevron-notch Si chip via acoustic emission2026 · Microelectronics Reliability Vol. 178 p. 116042-116042 2026年3月 研究論文（学術雑誌）
• Study on interfacial mechanism of Ag–Si immiscible sintering for robust migration inhibition2026 · Materials & Design 2026年6月 研究論文（学術雑誌）
• Surface driving stress-assisted rapid and large area silver porous sheet bonding for power electronics packaging2026 · JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY Vol. 253 p. 246-257 2026年5月10日 研究論文（学術雑誌）
• Highly active inversed CeO2/Ni catalysts prepared by flame spray pyrolysis for CO2 methanation2026 · Powder Technology p. 122300-122300 2026年2月 研究論文（学術雑誌）

• Official profile