Tohoku University · Faculty of Engineering / Graduate School of Engineering · 准教授

Research keywordswafer bonding・surface activated bonding・microneedle arrays・continuous glucose monitoring・Au-Au bonding・GaN thermal management・perhydropolysilazane・microfluidic ISF collection

This is a public-data preview. Personalized fit, contact angles, and saved workflows require sign-in.

• Low pressure Au–Au bonding using flat-topped micro-bump Au arrays fabricated by Au film transfer and coining methodsShintaro Goto, Kai Takeuchi, Le Hac Huong Thu, Takashi Matsumae, Hideki Takagi, Yuichi Kurashima, Eiji Higurashi
• Room temperature direct bonding and debonding of polymer film on glass wafer for fabrication of flexible electronic devicesK. Takeuchi, M. Fujino, T. Suga, M. Koizumi, T. Someya
• Flexible and porous microneedles of PDMS for continuous glucose monitoringKai Takeuchi, Nobuyuki Takama, Rie Kinoshita, Teru Okitsu, Beomjoon Kim
• Room temperature wafer bonding via polysilazane for vacuum sealing bondingKai Takeuchi, Eiji Higurashi

• 高出力用光学素子実装のための直接接合技術の開発竹内魁
• 光学素子実装のための酸化アルミニウム中間層を介したガラス材料の常温透明接合竹内魁
• ナノ界面制御による常温接合基盤技術の創出日暮 栄治, 竹内 魁
• 常温接合技術に基づく耐腐食性接合界面の創出竹内 魁

• Official profile