Shibaura Institute of Technology · Faculty of Engineering, Materials Chemistry Program, Environmental and Materials Engineering Course · 教授

Research keywordselectronic packaging reliability・thermal fatigue・solder joint mechanics・die attach joints・finite element analysis・crack propagation・power semiconductor modules

Research fields接合・電子デバイス、電子機器

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• Fatigue Properties of Sintered Ag Nanoparticles Evaluated by a Pseudo-Fracture Mechanics Approach2025
• Effect of Fatigue Crack Network in Die-attach Joints on Thermal Resistance2022
• Fatigue Life Prediction of Die-Attach Joint in Power Semiconductors Subjected to Biaxial Stress by High-Speed Thermal Cycling2022 · MATERIALS TRANSACTIONS
• Fracture Simulation of Redistribution Layer in Fan-Out Wafer-Level Package Based on Fatigue Crack Growth Characteristics of Insulating Polymer2022 · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

• パワー半導体デバイスダイアタッチ接合部の疲労き裂ネットワーク破壊寿命予測法の確立2021 · 科学研究費助成事業
• パワーモジュール用Agナノ粒子焼結接合部の疲労き裂進展寿命予測手法の確立2017 · 科学研究費助成事業
• 応力緩和性能に優れる高温ダイアタッチ用Agナノ粒子焼結接合材料の開発2014 · 科学研究費助成事業
• Ａｇ－エポキシ系等方性導電性接着剤の疲労寿命解析手法の確立2011 · 科学研究費助成事業

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