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Manufacturing

DISCO Corporation

株式会社ディスコ

DISCO / 株式会社ディスコ is a Japanese precision processing equipment and tool company that cuts, grinds, and polishes semiconductor and electronic-component wafers, chips, and packaging materials to extremely high precision. It is neither a front-end lithography/deposition equipment company nor a general machinery manufacturer.

Main roles
R&D & basic research, Production engineering, quality & manufacturing, Quality assurance (software & manufacturing), Corporate sales & BD
Ticker
6146

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